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The level of power adapter thermal design

source:power adapter     Popular:adapter     release time:2021-04-19 10:26:06     Article author:sznbone    

  The so-called thermal design is to minimize the heat input of electronic equipment, and improve the heat dissipation effect, discharge the harmful heat inside the electronic equipment to the environment outside the electronic equipment, and obtain a suitable working temperature so that it does not exceed the limit of reliability. Value to ensure reliable and safe operation of the equipment. The thermal design of electronic equipment can be divided into 3 levels.

The level of power adapter thermal design(图1)

  (1) System-level thermal design of electronic equipment chassis, machine frame and square cavity, that is, systems-level thermal design.

  (2) Thermal design at the electronic module, heat sink, and PCB level, that is, package thermal design.

  (3) Component-level thermal design, that is, component-level thermal design.

  System-level thermal design mainly studies the influence of the temperature of the environment in which electronic equipment is located. Ambient temperature is an important boundary condition for system-level thermal design. System-level thermal design is to take measures to control the ambient temperature so that electronic equipment can work in a suitable temperature environment.

  The biggest problem faced by system-level manufacturers is to develop a case, frame and square cavity with high heat dissipation efficiency, so that heat can be quickly introduced into the environment. The design considerations of each type of electronic device are different, and it is necessary to clearly understand the performance and size constraints of the electronic device. For example, a reliable and effective connection must be made between the metal block and the PCB gasket. Usually, the heat reaches the copper block on another layer through the thermal vias on the PCB, and then the heat enters the housing or external heat sink through heat conduction.

  When a large amount of heat needs to be removed in an enclosure, an external radiator is needed. The external radiator expands the heat exchange surface to facilitate the introduction of heat into the air. Commonly used materials for radiators are aluminum or copper. Since the heat transfer between the radiator and the air is convective, it is necessary to optimize the geometry of the radiator. The optimal design must consider the air flow around the radiator, and the air flow in this area is affected by the radiator. This is a challenge for the radiator optimization design. The performance of the heat sink depends on the material, the number of fins, the thickness of the fins and the thickness of the substrate. Copper material has a high thermal conductivity, but aluminum is lighter in the same volume and cheaper in price. For example, in some PCBs, some substrates are used to improve the heat transfer capability. These substrates use ceramics or are coated with copper, aluminum or other materials.

  Package-level thermal design has developed relatively mature abroad, and the major of electronic component packaging has emerged. The package-level thermal design is closely related to the circuit design and structural design of the device. Proper selection of PCB substrate is an important part of package-level thermal design. The types and characteristics of copper clad laminates are the items that PCB design and manufacturing process personnel care about. In addition to the generally required strength, insulation, dielectric coefficient, etc., there are special requirements for the thermal performance of copper clad laminates. There are two aspects to the thermal performance of copper clad laminates.

  (1) The temperature resistance characteristics of the copper clad laminate. The epoxy glass cloth copper clad laminate has excellent electrical properties and chemical stability, and the working temperature is -230℃~260℃. In addition to the above-mentioned excellent properties, polyimide copper clad laminates also have the characteristics of small dielectric coefficient and small signal transmission delay.

  (2) Thermal conductivity of copper clad laminate. Use materials with high temperature resistance and high thermal conductivity as the material of the PCB. Under the same conditions, the temperature of the epoxy glass cloth laminate graphic wires can rise up to 40°C, while the metal core PCB graphic wires have a temperature rise of less than 20°C. Therefore, metal core PCBs have been widely used in electronic equipment.

  The various components of electronic equipment are composed of components of different materials, such as silicon chips, silicon oxide insulating films, aluminum interconnect lines, metal lead frames, and plastic packaging shells. These materials have different coefficients of thermal expansion. Once they encounter temperature changes, compressive or tensile stresses will be generated at the interface of different materials, so thermal mismatch stresses, referred to as thermal stresses, are generated. The mismatch of thermal properties of materials is the internal cause of thermal stress, and the temperature change is the external cause of thermal stress.


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